MCP 产品

MCP(多芯片封装存储器),广泛应用于通信模块、IoT等领域。

Part no. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model
SCP30N2G1GSL-

2Gb+1Gb

256Mbx8 (NAND)+32Mbx32 (LPD2)

1.8V

FBGA162

10.5x8

MP

1066/800

E I

IBIS

SCP30N1G12SX-

1Gb+512Mb

128Mbx8 (NAND) +16Mbx32 (LPD2)

1.8V

FBGA162

10.5x8

MP

1066/800

E I

IBIS

SCP30N1G1GSL-

1Gb+1Gb

128Mbx8 (NAND)+32Mbx32 (LPD2)

1.8V

FBGA162

10.5x8

MP

1066/800

E I

IBIS

notes

  • Temperature Specification:

    MCP: E = Extended grade(-25 °C to +85 °C); I = Industrial grade(-40 °C to +85 °C)